Qualcomm Announced Snapdragon 870

Qualcomm unveiled the flagship Snapdragon 888 5G chipset earlier last month. It has been built on the 5nm process node and already powers devices like the Mi 11, Galaxy S21 series, and more. Now, Qualcomm is giving phone makers the arsenal to launch more affordable flagship phones in 2021. It has announced the Snapdragon 870 5G chipset today, which is essentially a minor upgrade over the Snapdragon 865.

Snapdragon 870 Specifications

Qualcomm® Artificial Intelligence (AI) Engine

AIE GPU: Qualcomm® Adreno™ 650 GPU

AIE CPU: Qualcomm® Kryo™ 585 CPU

Hexagon Processor: Qualcomm® Hexagon™ Scalar Accelerator, Qualcomm® Hexagon™ Vector eXtensions (HVX), Qualcomm® Hexagon™ Tensor Accelerator, Qualcomm® Sensing Hub, Qualcomm® Hexagon™ 698 Processor

Cellular Modem

Modem Name: Qualcomm® Snapdragon™ X55 5G Modem-RF system

Performance Enhancement Technologies: Qualcomm® Wideband Envelope Tracking, Qualcomm® Smart Transmit™ technology, Qualcomm® Signal Boost adaptive antenna tuning, Qualcomm® 5G PowerSave

5G Spectrum: Dynamic Spectrum Sharing (DSS), mmWave, sub-6 GHz

5G mmWave specs: 800 MHz bandwidth, 8 carriers, 2×2 MIMO

5G sub-6 GHz specs: 200 MHz bandwidth, 4×4 MIMO

Multi-SIM features: Global 5G multi-SIM

Cellular Technology: LTE including CBRS support, HSPA, WCDMA, TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE

5G Uplink Speed: Up to 3 Gbps

5G Downlink speed:  Up to 7.5 Gbps


Wi-Fi Standards: Wi-Fi 6, Wi-Fi 5, 802.11a/b/g/n

Qualcomm® Wi-Fi 6 technology features: MU-MIMO (Uplink and Downlink), 8×8 sounding, OFDMA (Uplink and Downlink), 1024 QAM, Dual-band simultaneous (DBS), WPA3 security support, Target Wake Time

Wi-Fi Spectral Bands: 2.4GHz, 5GHz

Peak Speed: 1.774 Gbps


Bluetooth Audio:  Qualcomm® aptX™ Adaptive Audio, Qualcomm TrueWireless™ Technology, Bluetooth 5.2

Bluetooth Version: Bluetooth 5.2


Near Field Communications: Supported


Satellite Systems Support: Beidou, Galileo, GLONASS, Dual-frequency GNSS, NavIC enabled, GPS, GNSS, QZSS, SBAS


USB Version: USB 3.1, USB-C


CPU Clock Speed: Up to 3.2 GHz

CPU Cores:  Qualcomm® Kryo™ 585 CPU, Octa-core CPU

CPU Architecture: 64-bit


Process Technology: 7 nm

Qualcomm® FastConnect™ Subsystem

Wi-Fi/Bluetooth Subsystem: Qualcomm® FastConnect™ 6800

Bluetooth Features: Qualcomm® TrueWireless™ Technology, Bluetooth 5.2, Qualcomm® aptX™ Adaptive Audio

Wi-Fi 6 features: MU-MIMO (Uplink and Downlink), 8×8 sounding, OFDMA (Uplink and Downlink), Dual-band simultaneous (DBS), WPA3 security support, Target Wake Time


Image Signal Processor: Qualcomm® Spectra™ 480 image signal processor, Hardware accelerator for computer vision (CV-ISP), Dual 14-bit CV-ISPs

Single Camera: Up to 200 MP

Camera Features: HEIF photo capture

Slow Motion Video Capture: 720p @ 960 FPS

Video Capture Formats: Dolby Vision, HDR10, HDR10+, HLG

Dual Camera, ZSL, 30fps: Up to 25 MP

Single Camera, MFNR, ZSL, 30fps: Up to 64 MP

Video Capture Features: 4K video capture with simultaneous 64MP photo capture, Rec. 2020 color gamut video capture, Up to 10-bit color depth video capture


Codec Support: Dolby Vision, H.265 (HEVC), HDR10+, HLG, HDR10, H.264 (AVC), VP8, VP9


Max On-Device Display: 4K @ 60 Hz, QHD+ @ 144 Hz

Max External Display: 4K @ 60 Hz

HDR: HDR10+, HDR10

Color Depth: Up to 10-bit

Color Gamut: Rec2020

General Audio

Audio Technology: Qualcomm® Hexagon™ Voice Assistant Accelerator, Qualcomm Aqstic™ audio codec up to Qualcomm® WCD9385, Qualcomm Aqstic™ smart speaker amplifier up to Qualcomm® WSA8815, Qualcomm Aqstic™ audio technology


GPU Name: Qualcomm® Adreno™ 650 GPU

GPU Video Playback: Volumetric VR video playback, 8K 360 VR video playback

API Support: OpenCL™ 2.0 FP, Vulkan® 1.1, OpenGL® ES 3.2, DX12


Qualcomm® Quick Charge™ Technology Support: Qualcomm® Quick Charge™ 4+ technology

Security Support

Fingerprint Sensor: Qualcomm® 3D Sonic, Qualcomm® 3D Sonic Max

Secure Processing Unit: Biometric Authentication (Fingerprint, Iris, Voice, Face)

Security Features: Camera Security, Crypto Engine, Key Provisioning Security, Malware Protection, Qualcomm® Content Protection, Qualcomm® Mobile Security, Qualcomm® Processor Security, Qualcomm® Trusted Execution Environment (TEE), Secure Boot, Secure Token


Memory speed: 2750MHz

Memory Type: 4x16bit, LPDDR5


Part Number(s): SM8250-AC


“Building upon the success of Snapdragon 865 and 865+, the new Snapdragon 870 was designed to address OEM and mobile industry requirements,” mentioned Kedar Kondap, VP, product management, Qualcomm Technologies, Inc in the official blog post. Well-known OEM partners, including Motorola, iQOO, OnePlus, OPPO, and Xiaomi, will launch phones powered by this chipset in the first quarter of 2021.

The sole purpose behind the launch of the Snapdragon 870 is that phone makers will now be able to pitch their affordable flagships as powered by this year’s chipset. It enables them to get rid of the stigma attached with the use of last year’s Snapdragon 865/ 865+ on budget flagships in the sub-Rs. 35,000 price bracket in 2021.

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